Precision bearings, slewing rings and linear guides for semiconductor technology and cleanroom automation

Precision & Reliability

In semiconductor technology, precision, cleanroom compatibility, and process reliability are key factors in determining product quality and cost-effectiveness. Whether it’s wafer handling, lithography, inspection systems, or cleanroom automation—modern chip manufacturing equipment places the highest demands on every single component.

Franke supports OEMs and equipment manufacturers with innovative wire roller bearings, slewing rings, and linear guides that have been specifically developed for high-precision motion applications. Thanks to their compact design, low weight, and high integrability, they help make machines more powerful, efficient, and cost-effective.

Semiconductor Technology & Chip Manufacturing

The manufacture of modern semiconductors requires maximum process stability at the microscopic level. At the same time, demands for dynamic performance, automation, and cost-effectiveness are constantly increasing. Design engineers and equipment manufacturers therefore face the challenge of achieving highly precise movements reliably and reproducibly under complex environmental conditions.

  • Cleanroom and Contamination Requirements
    Even the smallest particles can compromise the quality of sensitive manufacturing processes. Components must therefore be suitable for cleanroom use, have low emissions, and help prevent contamination.
     
  • Highest Precision and Repeatability
    Precise positioning is critical in wafer-handling systems, inspection systems, and lithography systems. These systems require minimal runout deviations, the highest repeatability, and consistently stable motion sequences.
     
  • Dynamic Movements and Short Cycle Times
    Modern manufacturing systems must achieve high throughputs. This requires high speeds, rapid acceleration, and, at the same time, precise and controlled movements.
     
  • Limited Installation Space
    Die Integration zusätzlicher Funktionen in immer kompaktere Maschinenkonzepte stellt hohe Anforderungen an Konstruktion und Komponenten. Platzsparende Lösungen werden zu einem entscheidenden Wettbewerbsvorteil.
     
  • Maximale Zuverlässigkeit
    Stillstände in der Chipherstellung verursachen hohe Kosten. Komponenten müssen dauerhaft zuverlässig arbeiten, Wartungsaufwände minimieren und eine maximale Anlagenverfügbarkeit unterstützen.
     
  • Wirtschaftlichkeit über den gesamten Lebenszyklus
    Neben der technischen Performance gewinnen Gewichtsreduzierung, vereinfachte Konstruktionen und ein niedriger Total Cost of Ownership zunehmend an Bedeutung.